{"id":10573,"date":"2026-11-02T12:55:04","date_gmt":"2026-11-02T04:55:04","guid":{"rendered":"https:\/\/www.nazrulanuar.com\/author\/?page_id=10573"},"modified":"2026-11-10T22:53:59","modified_gmt":"2026-11-10T14:53:59","slug":"resumef","status":"publish","type":"page","link":"https:\/\/www.nazrulanuar.com\/author\/resumef\/","title":{"rendered":"Resume Final"},"content":{"rendered":"\t\t
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\"Assoc.
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Assoc. Prof. Ir. Dr. NAZRUL ANUAR BIN NAYAN<\/h2>
Associate Professor and Professional Engineer with Practicing Certificate (PEPC) in Electronics<\/div>

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H-Index: 17<\/span>
Citations: 801 (Scopus)<\/span>
PEPC: C115815<\/span><\/div>

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Mobile:<\/strong> +60-12-2124974 \u00a0|\u00a0 Date joined UKM::<\/strong>
29\/03\/2008<\/div>
Email:<\/strong> nazrul@ukm.edu.my<\/a> \u00a0|\u00a0 Website:<\/strong> https:\/\/www.nazrulanuar.com<\/a> \u00a0|\u00a0 LinkedIn:<\/strong> nazrulanuar<\/a><\/span> |\u00a0 Date of Birth:<\/strong>
21\/11\/1974<\/div><\/div><\/div><\/div>

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Executive Biography<\/h3>

Assoc. Prof. Ir. Dr. Nazrul Anuar Nayan has over 25 years of engineering experience in electronic systems across industry and academia. He has been registered with the Board of Engineers Malaysia (BEM) as a Professional Engineer (PE) since 2013 and holds a Professional Engineer with Practicing Certificate (PEPC C115815) in Electronic Engineering, obtained in 2015.<\/p>

His technical background combines seven years of industry engineering experience at Hitachi Ltd., Unisem (M) Bhd., and STATS ChipPAC (M) Sdn. Bhd., with formal training abroad. He completed his B.Eng. at The University of Tokyo, followed by an M.Eng. and D.Eng. in Electronics and Information Systems from Gifu University. He later completed a two-year postdoctoral appointment in biomedical engineering at the University of Oxford. His applied research focuses on ELECTRONIC SYSTEMS<\/strong>, linking semiconductor packaging, low-power digital IC design, non-invasive biomedical sensors, and predictive industrial electronics across three core pillars:<\/p>

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Pillar 1: Semiconductor Packaging, Digital IC Design & Embedded Robotics<\/div>
Work covers physical device packaging, low-power integrated circuit design, nanomaterial devices, and embedded control. In semiconductor packaging, an ejectorless pick-up mechanism was developed to prevent die crack failures in ultra-thin wafer handling (Adv. Sci. Technol. Res. J.<\/em>, 2020), directly supporting laboratory teaching modules for IC assembly, test, and reliability. Nanoscale device research is supported by a 2024 FRGS grant investigating two-dimensional van der Waals heterostructures to develop sensors for continuous blood pressure monitoring. Digital circuit implementations apply charge-recovery logic via Two-Phase Adiabatic Static Clocked Logic (2PASCL) to reduce dynamic power dissipation. Silicon-verified and modeled architectures include low-power adiabatic multipliers (Microelectronics Journal<\/em>, 2012), 9T SRAM cells (The Journal of Engineering<\/em>, 2014), and high-frequency phase detectors for RFID tags (Analog Integr. Circuits Signal Process.<\/em>, 2025). At the embedded system level, microcontroller-based robotics platforms deploy real-time control algorithms to evaluate technical problem-solving and computational thinking (Computers in Human Behavior Reports<\/em>, 2026).<\/div><\/div>
Pillar 2: Biomedical Electronic Systems & Instrumentation<\/div>
Research focuses on hardware circuit implementation and digital signal processing for non-invasive physiological monitoring, extending clinical instrumentation work conducted at Oxford. Algorithmic pipelines extract diagnostic features directly from photoplethysmogram (PPG) and arterial pulse waveforms. Developed models detect vascular occlusion and arterial stiffness (J. Am. Coll. Cardiol.<\/em>, 2023), classify respiratory distress severity (Front. Public Health<\/em>, 2022), and identify screening markers for type-2 diabetes (IJACSA<\/em>, 2026).<\/div><\/div>
Pillar 3: Predictive Electronics, Acoustic Sensing & Telemetry Systems<\/div>
Research focuses on predictive electronics, condition monitoring hardware, and low-latency wireless telemetry circuits. Acoustic emission (AE) sensor nodes capture high-frequency stress waves in pipeline infrastructure, using discrete wavelet transform (DWT) denoising algorithms to locate micro-crack propagation and localized corrosion before mechanical failure (Sensors<\/em>, 2022; Energies<\/em>, 2023). Telemetry work develops dynamic radio resource management and 5G network-slicing protocols to ensure deterministic, fault-tolerant data links for mission-critical emergency communications (IEEE Access<\/em>, 2022).<\/div><\/div><\/div><\/div>

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Professional Appointments & Memberships<\/h3>